Define the assembly
Part geometry, gap or potting depth, substrates and sensitive components.
Application engineering
Silicone dispensing on an electronic assemblySilicone solutions built around the assembly.
EST connects the part, operating environment and production process to practical material routes for electronics, consumer devices, energy systems, mobility and textile printing.
Engineering method
Selection starts with the conditions the material must survive.
A data sheet describes a material. A dependable recommendation also considers the geometry, substrates, cure window and how the part will be used.
Map the exposure
Temperature, moisture, electrical demands, vibration and service life.
Fit the process
1K or 2K dispensing, viscosity, working time, cure schedule and line speed.
Validate the candidate
Adhesion, cure, electrical or thermal performance and production trials.
Application fields
Experience across four manufacturing environments.
Each field is organized by typical assemblies, engineering priorities and the EST material routes available for evaluation.
01
Electronics & semiconductors
Protect control boards and sensitive components while balancing electrical insulation, stress, heat and production requirements.
Typical assemblies
- PCB and control modules
- Sensors and connectors
- Power modules and LED assemblies
Engineering priorities
- Moisture and contamination protection
- Electrical insulation and low stress
- Thermal cycling and vibration resistance
Material routes
- Potting and encapsulation
- Bonding and sealing
- Thermal management materials
02
Consumer electronics
Support compact, high-volume products where controlled flow, reliable bonding and repeatable curing matter on the production line.
Typical assemblies
- Lighting and smart-home devices
- Displays, cameras and sensors
- Wearables, connectors and small modules
Engineering priorities
- Miniaturized gaps and controlled flow
- Low-stress bonding and sealing
- Appearance, cure speed and repeatability
Material routes
- 1K RTV bonding and sealing
- 2K potting systems
- Transparent and controlled-cure options
03
New energy & automotive
Address heat, weather, vibration and electrical protection in energy conversion, charging and vehicle electronic assemblies.
Typical assemblies
- Battery and power-conversion modules
- Charging and solar electronics
- Vehicle controllers, lighting and sensors
Engineering priorities
- Heat transfer and temperature cycling
- Weather, moisture and vibration
- Electrical protection and long-term reliability
Material routes
- Thermally conductive materials
- Protective potting systems
- Flexible bonding and sealing
04
Textile printing
Create flexible, tactile and durable printed effects with silicone ink systems designed for screen-printing workflows.
Typical assemblies
- Sportswear and stretch fabrics
- Logos, labels and decorative graphics
- Anti-slip and raised tactile effects
Engineering priorities
- Stretch and recovery
- Wash durability and hand feel
- Color, print definition and layer build
Material routes
- TSL silicone ink series
- Color and process additives
- Screen-printing trial support
Application-to-material map
Move from a manufacturing need to the right product system.
These routes narrow the search. Final selection still depends on the exact substrates, process and validation targets.
Application fieldRelevant product systems
01Electronics & semiconductors
02Consumer electronics
03New energy & automotive
04Textile printing
Application validation
A shortlist becomes useful only after it is tested on the real assembly.
EST's application work combines formulation knowledge with practical process checks. Share the part, substrate and operating requirements so the trial plan reflects production reality.
- Substrate compatibility and adhesion
- Mixing, dispensing and cure window
- Thermal, electrical and environmental targets
- Pilot-part review before production use
Start with your application
Tell us what the assembly needs to do.
Use the guided selector for an initial shortlist, or send the assembly, substrates, process and performance targets to an EST engineer.